Announcements

SMACD & PRIME Photos

We hope that you have enjoyed SMACD & PRIME Conferences in Lausanne, Switzerland, and that you had a safe trip back home. A Photo Album, with 432 photos, has been prepared. You can have a look at the very best moments of SMACD and PRIME 2019 here.

https://mega.nz/#F!HF8FxSDB!85ejGW6BosDjvukaMVteVg

Hope to meet you all again for SMACD and PRIME 2020 in Erfurt, at the heart of Germany.

This year Special Sessions:

  • Do You Still Handcraft your Analog and RF Layouts?
  • Deep Learning for Analog EDA: Are we there yet?
  • MEMS & Heterogeneous Systems: Which Design Tools and Methodologies are Missing?
  • Cutting Edge Test Solutions for Analog, Mixed-Signal, and RF ICs

Paper Publication

The conference is technically co-sponsored by IEEE, IEEE CAS and IEEE CEDA. The conference proceedings will be submitted for inclusion in IEEExplore.

Special Issue

A selection of papers will be considered for a special issue of
Integration, the VLSI Journal, Elsevier

Call For Papers

The 2019 edition of the International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) will be held in Lausanne, Switzerland, as a forum devoted to modeling, simulation and synthesis for Analog, Mixed-signal, RF (AMS/RF) and multi-domain (MEMs, nanoelectronics, optoelectronics, biological, etc.) integrated circuits and systems. Experiences with modeling, simulation and synthesis techniques in diverse application areas are also welcomed. Objective technologies include CMOS, beyond CMOS, and More-than- Moore such as MEMs, power devices, sensors, passives, etc.

SMACD 2019 is Technically Co-sponsored by IEEE, IEEE CEDA and IEEE CAS. The conference proceedings will be submitted for inclusion in IEEExplore, and, a selection of papers will be considered for a special issue of Integration, the VLSI Journal, Elsevier.

SMACD 2019 will be co-located with the 15th Conference on PhD Research in Microelectronics and Electronics (PRIME 2019).

Important Dates

3rd May 2019
Author Notification
17th May 2019
Camera Ready Paper Submission
17th May 2019
Early Registration Deadline
Call for Papers

Areas of Interest

Topics of interest include, but are not limited to:

Modeling

  • Compact modeling
  • Performance and behavioral modeling
  • Power and thermal modeling
  • Reliability and variability modeling
  • Multi-domain modeling
  • RF/microwave/mm-wave modeling
  • Modeling languages and applications
  • Linear and non-linear model order reduction
  • Circuit & system theory and application
  • Fault modeling

Simulation, verification and test

  • Behavioral simulation
  • Numerical and symbolic simulation methods
  • Simulation and estimation methods of variability and yield
  • Analysis of reliability effects (aging, electromigration, stress...)
  • High-frequency simulation techniques
  • Multilevel simulation techniques
  • Multi-domain simulation
  • Formal and functional verification
  • Fault simulation and diagnosis

Synthesis

  • Multilevel design methodologies
  • Synthesis methods of multi-domain circuit and systems
  • Physical synthesis
  • High-frequency circuit and system design
  • Low-power design techniques
  • Parasitic-aware synthesis
  • Variability-aware & reliability-aware design
  • Performance monitors & self-healing techniques
  • Test and desig-for-test methods
  • Fault tolerance
  • Language-based synthesis techniques
  • Optimization methods applied to circuit and system design

Applications of modeling, simulation and synthesis in :

  • Automotive
  • Bio-electronics
  • Security
  • Internet-of-things
  • Communications
  • Renewable systems
  • Energy management
  • Engineering education